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Varun Bhambhani

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Medialย โ€ขย 1d

๐Ÿ—ž๏ธ Medial Bulletin ๐Ÿค– AI & Telecom Infrastructure โ€ข GSMA launches the โ€œOpen Telco AIโ€ initiative at MWC 2026, aiming to accelerate AI-native telecom networks and integrate AI into network operations and customer services. โ€ข NEC showcases agentic AI for autonomous telecom operations, enabling networks to manage configuration, monitoring and optimisation without manual intervention. ๐Ÿ‡ฎ๐Ÿ‡ณ India Semiconductor & Tech Diplomacy โ€ข India sends a semiconductor delegation to the Netherlands, seeking partnerships with firms like ASML and NXP to strengthen domestic chip manufacturing capabilities. โ€ข Government continues offering subsidies covering up to 50% of semiconductor project costs to attract global fabrication and packaging investments. ๐Ÿงฉ Chips & Hardware Innovation โ€ข Intel reassesses the rollout of its 18A manufacturing node, considering broader external foundry access as part of its chip manufacturing strategy. โ€ข Advanced packaging technologies for AI chips are showcased at MWC, focusing on higher bandwidth memory integration for next-generation data centres. ๐Ÿ“ก Connectivity & 6G Development โ€ข Qualcomm and Rohde & Schwarz demonstrate FR1โ€“FR3 carrier aggregation, marking a key step toward future 6G-ready mobile networks. โ€ข MWC 2026 highlights AI-driven telecom transformation, with operators preparing for large-scale 5G expansion and early 6G research. ๐Ÿ“Š Industry Signals โ€ข Financial sector leaders highlight that AI-driven analytics will reshape lending models, pushing banks toward automated risk assessment and decision systems. Stay Updated. Stay Ahead with Medial.

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