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Varun Bhambhani
ย โขย
Medialย โขย 24d
๐๏ธ Medial Bulletin ๐ค AI & Telecom Infrastructure โข GSMA launches the โOpen Telco AIโ initiative at MWC 2026, aiming to accelerate AI-native telecom networks and integrate AI into network operations and customer services. โข NEC showcases agentic AI for autonomous telecom operations, enabling networks to manage configuration, monitoring and optimisation without manual intervention. ๐ฎ๐ณ India Semiconductor & Tech Diplomacy โข India sends a semiconductor delegation to the Netherlands, seeking partnerships with firms like ASML and NXP to strengthen domestic chip manufacturing capabilities. โข Government continues offering subsidies covering up to 50% of semiconductor project costs to attract global fabrication and packaging investments. ๐งฉ Chips & Hardware Innovation โข Intel reassesses the rollout of its 18A manufacturing node, considering broader external foundry access as part of its chip manufacturing strategy. โข Advanced packaging technologies for AI chips are showcased at MWC, focusing on higher bandwidth memory integration for next-generation data centres. ๐ก Connectivity & 6G Development โข Qualcomm and Rohde & Schwarz demonstrate FR1โFR3 carrier aggregation, marking a key step toward future 6G-ready mobile networks. โข MWC 2026 highlights AI-driven telecom transformation, with operators preparing for large-scale 5G expansion and early 6G research. ๐ Industry Signals โข Financial sector leaders highlight that AI-driven analytics will reshape lending models, pushing banks toward automated risk assessment and decision systems. Stay Updated. Stay Ahead with Medial.
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